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    J STD 001 : E

    REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Institute of Printed Circuits

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    J STD 001 : D

    REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Institute of Printed Circuits

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    IPC DW 426 : 0

    SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING

    Institute of Printed Circuits

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    J STD 013 : 0

    IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY

    Institute of Printed Circuits

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    IPC FA 251 : 0

    GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS

    Institute of Printed Circuits

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    IPC TR 467 : 0

    SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)

    Institute of Printed Circuits

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    IPC SM 817 : A

    GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES

    Institute of Printed Circuits

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    IPC DW 424 : 0

    GENERAL SPECIFICATION FOR ENCAPSULATED DISCRETE WIRE INTERCONNECTION BOARDS

    Institute of Printed Circuits

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    IPC TF 870 : 0

    QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS

    Institute of Printed Circuits

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    IPC HM 860 : 0

    SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS

    Institute of Printed Circuits