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    • Plug-and-socket devices. Connectors
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    EIA 700AOAC : 1996

    DETAIL SPECIFICATION FOR 1.00 MM PITCH, 88 CIRCUIT DRAM MEMORY CARD INTERCONNECT SYSTEM

    JEDEC Solid State Technology Association

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    EIA 540CAAB : 89(R2007)

    DETAIL SPECIFICATION ON RELAY SOCKETS - 5 A FOR BALANCED ARMATURE RELAY

    JEDEC Solid State Technology Association

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    EIA 540EA00 : 1997

    BLANK DETAIL SPECIFICATION FOR ROUND STYLE SOCKETS

    JEDEC Solid State Technology Association

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    EIA 540G000 : 1993(R2001)

    SECTIONAL SPECIFICATION FOR BURN IN SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540FAAD : 1992(R2001)

    DETAIL SPECIFICATION FOR MULTI-PACKAGE 50 MIL PITCH, ANGLED MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540AAAA : 1990(R1998)

    DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR LEADLESS TYPE A (1.27mm (0.050in) SPACING) CHIP CARRIERS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540DB00 : 93(R1999)

    BLANK DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS

    JEDEC Solid State Technology Association

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    EIA 406 : 1973(R1990)

    GENERAL DOCUMENT FOR CONNECTORS, ELECTRIC, PRINTED WIRING BOARD

    JEDEC Solid State Technology Association

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    EIA 506 : 1984

    DIMENSIONAL AND FUNCTIONAL CHARACTERISTICS DEFINING SOCKETS FOR LEADLESS TYPE A CHIP CARRIERS (0.050 SPACING),

    JEDEC Solid State Technology Association

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    EIA 540FAAB : 92(R1998)

    DETAIL SPECIFICATION FOR MULTI-PACKAGE 100 MIL PITCH, ANGLED MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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