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    • Plug-and-socket devices. Connectors
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    EIA 700AOAA : 1996

    DETAIL SPECIFICATION FOR 1.27 MM PITCH, RIBBON CONTACT, TRAPEZOIDAL SHAPED, SHIELDED I/O CONNECTOR

    JEDEC Solid State Technology Association

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    EIA 700AAAB : 1996

    DETAIL SPECIFICATION FOR 1.0 MM, TWO-PART CONNECTORS FOR USE WITH PARALLEL PRINTED BOARDS

    JEDEC Solid State Technology Association

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    EIA 540D000 : A1991(R1997)

    SECTIONAL SPECIFICATION FOR IN-LINE PACKAGE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540ABAA : 1991(R1997)

    DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACK 0.635mm (.025') LEAD SPACING (GULLWING)

    JEDEC Solid State Technology Association

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    EIA 540CA00 : 89(R2007)

    BLANK DETAIL SPECIFICATION ON RELAY SOCKETS

    JEDEC Solid State Technology Association

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    EIA 540ADAA : 92(R1998)

    DETAIL SPECIFICATION FOR ADAPTOR CARRIER QUAD FLATPACK TO PIN GRID ARRAY SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540FAAC : 1992(R2001)

    DETAIL SPECIFICATION FOR MULTI-PACKAGE 50 MIL PITCH, VERTICAL MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540AB00 : 1991(R1997)

    BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACKAGES FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 489 : 82(R1990)

    SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, ROUND STYLE

    JEDEC Solid State Technology Association

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    EIA IS 84 : A1992

    INTERIM DETAIL SPECIFICATION FOR 2.5 MILLIMETER, TWO-PART CONNECTOR FOR USE WITH PRINTED BOARDS AND BACKPLANES

    JEDEC Solid State Technology Association

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