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    • Plug-and-socket devices. Connectors
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    EIA 540CAAA : 89(R2007)

    DETAIL SPECIFICATION ON RELAY SOCKET - 10 A FOR BALANCED ARMATURE RELAY

    JEDEC Solid State Technology Association

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    EIA 540BAAB : 1990(R1997)

    DETAIL SPECIFICATION FOR NON-MECHANICALLY ACTUATED SOCKETS FOR PIN GRID ARRAY DEVICES WITH 2.54mm X 2.54mm (0.1' X 0.1') SPACING FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540DBAA : 94(R1999)

    DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540GAAA : 1993(R2001)

    DETAIL SPECIFICATION FOR BURN IN SOCKETS FOR CHIP CARRIER PACKAGES WITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540DA00 : 1991(R1997)

    BLANK DETAIL SPECIFICATION FOR DUAL IN-LINE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 5400BAA : 94(R1997)

    DETAIL SPECIFICATION FOR DECOUPLING CAPACITOR DUAL IN-LINE PACKAGE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540BAAA : A1996

    DETAIL SPECIFICATION: MECHANICALLY ACTUATED (ZERO AND LOW INSERTION FORCE) SOCKETS FOR PIN GRID ARRAY DEVICES WITH 2.54mm X 2.54mm (0.1' X 0.1') SPACING FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 507 : 83(R1990)

    DIMENSIONAL CHARACTERISTICS DEFINING EDGE CLIPS FOR USE WITH HYBRID AND CHIP CARRIERS,

    JEDEC Solid State Technology Association

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    EIA 540FAAA : 92(R1998)

    DETAIL SPECIFICATION FOR MULTI-PACKAGE 100 MIL PITCH, VERTICAL MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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    EIA 540C000 : 1988(R2007)

    SECTIONAL SPECIFICATION: SOCKETS FOR RELAYS FOR USE IN ELECTRONIC EQUIPMENT

    JEDEC Solid State Technology Association

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