09/30208696 DC : 0

Superseded

BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

Available format(s)

Hardcopy , PDF

Superseded date

07-31-2013

Language(s)

English

Publisher

British Standards Institution

1 Scope
2 Normative reference
3 Test and definition
  3.1 Melting temperature ranges
  3.2 Solidus temperature
  3.3 Liquidus temperature
  3.4 DSC curve
4 Test Equipment
  4.1 DSC
  4.2 Balance
  4.3 Pans
  4.4 Inert gas
  4.5 alumina powder
5 Calibration of the temperature
6 Test condition
  6.1 Sample size
  6.2 Inert gas flow
  6.3 Heating rate
7 Procedure for measuring the DSC curve
8 Solidus temperature: Temperature of melting starts
9 Liquidus temperature: Temperature of melting ends
Annex A (Normative) - Test report on melting temperature
        ranges of solder alloys
Annex B (Informative) - Example of test result (liquidus
        temperature)

BS EN 61189-11 ED.1

Committee	EPL/501
DocumentType	Draft
Pages	11
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 61189-11:2013

IEC 61189-1:1997+AMD1:2001 CSV	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
ISO 11357-1:2016	Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications