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09/30209670 DC : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BS EN 60749-21 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY

Available format(s)

Hardcopy , PDF

Superseded date

08-31-2011

Language(s)

English

1 Scope
2 Test apparatus
  2.1 Solder bath
  2.2 Dipping device
  2.3 Optical equipment
  2.4 Steam ageing equipment
  2.5 Lighting equipment
  2.6 Materials
      2.6.1 Flux
      2.6.2 Solder
  2.7 SMD reflow equipment
      2.7.1 Stencil or screen
      2.7.2 Rubber squeegee or metal spatula
      2.7.3 Test substrate
      2.7.4 Solder paste
      2.7.5 Reflow equipment
      2.7.6 Flux removal solvent
3 Procedure
  3.1 Lead-free backward compatibility
  3.2 Preconditioning
      3.2.1 Preconditioning by steam ageing
      3.2.2 Preconditioning by high temperature storage
  3.3 Procedure for dip and look solderability testing
      3.3.1 Solder dip conditions
      3.3.2 Procedure
  3.4 Procedure for simulated board mounting reflow
      solderability testing of SMDs
      3.4.1 Test equipment set-up
      3.4.2 Specimen preparation and surface condition
      3.4.3 Visual inspection
4 Summary
Bibliography

BS EN 60749-21

Committee
EPL/47
DocumentType
Draft
Pages
23
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

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US$23.42
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