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Superseded

View Superseded by

BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING

Available format(s)

Hardcopy , PDF

Superseded date

09-30-2016

Language(s)

English

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Definitions
4 Introduction
5 Soldering processability of components
6 Soldering tests - general
7 Soldering tests - Methods
8 Requirements and the statistical character
of results
9 Abbreviations

BS EN 60068-3-13

Committee	EPL/501
DocumentType	Draft
Pages	26
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 60068-3-13:2016

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-83:2011	Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
IEC PAS 62137-3:2008	Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC TR 60068-3-12:2014	Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method