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IEC 61193-3:2013
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Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
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IEC 61193-1:2001
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Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
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IEC 61188-5-3:2007
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Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
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IEC 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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IEC PAS 62326-7-1:2007
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Performance guide for single- and double-sided flexible printed wiring boards
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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BS QC 200012:1996
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Process assessment schedule for printed board design facilities
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IEC 61340-5-1:2016
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Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
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IEC 61188-1-1:1997
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Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
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IEC TR 61340-5-2:2007
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Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
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IEC 62326-1:2002
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Printed boards - Part 1: Generic specification
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IPC J STD 006 : C
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REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
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IPC J STD 004 : B
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REQUIREMENTS FOR SOLDERING FLUXES
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IPC TM 650 : 0
|
TEST METHODS MANUAL
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IEC 61189-1:1997+AMD1:2001 CSV
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Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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IPC PC 1990 : 1990
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GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
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IEC 62326-4:1996
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
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IPC A 610 : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC J STD 005 : A
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REQUIREMENTS FOR SOLDERING PASTES
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|
IPC J STD 002 : D
|
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
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|
IEC 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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IEC 61188-7:2017
|
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
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|
IEC 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
|
|
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
|
|
IEC 61188-5-6:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
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|
IEC 61188-5-1:2002
|
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
|
|
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions
|
|
IEC 61188-5-5:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
|
|
ISO 9001:2015
|
Quality management systems — Requirements
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|
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
|
|
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
|
|
IEC 62326-4-1:1996
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
|
|
IPC OI 645 : 0
|
STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
|
|
IEC 61188-5-4:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
|
|
IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS
|
|
IEC 61249-8-8:1997
|
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
|
|
IPC SM 817 : A
|
GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
|
|
IEC 61189-2:2006
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
|
|
IEC 60721-3-1:1997
|
Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage
|
|
IEC 61190-1-3:2007+AMD1:2010 CSV
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
|
|
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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