Name: 12/30262664 DC : DRAFT APR 2012
Brand: BSI

BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES

Published date

11-23-2012

Publisher

British Standards Institution

BS EN 62588

Committee	EPL/501
DocumentType	Draft
PublisherName	British Standards Institution
Status	Current

IPC J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61249-2-21:2003	Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Sorry this product is not available in your region.

Features

Abstract

General Product Information