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ASTM F 2405 : 2004

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
Available format(s)

Hardcopy , PDF

Superseded date

11-11-2014

Language(s)

English

Published date

05-01-2004

CONTAINED IN VOL. 10.04, 2015 Describes test method that covers the concentrations of trace metallic impurities in high purity (99.95 wt. % pure, or purer, with respect to metallic trace impurities) electronic grade copper.

1.1 This test method covers the concentrations of trace metallic impurities in high purity (99.95 wt. % pure, or purer, with respect to metallic trace impurities) electronic grade copper.

1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS).

1.3 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment, skillfully used by an experienced operator, is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of detection limits, and the like) known by the responsible technical committee to effect the reliability of high purity copper analyses.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Committee
F 01
DocumentType
Test Method
Pages
5
ProductNote
Reconfirmed 2004
PublisherName
American Society for Testing and Materials
Status
Superseded
SupersededBy

ASTM F 3192 : 2016 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)

ASTM E 180 : 2003 Standard Practice for Determining the Precision of ASTM Methods for Analysis and Testing of Industrial and Specialty Chemicals (Withdrawn 2009)
ASTM E 173 : 1993 Practice for Conducting Interlaboratory Studies of Methods for Chemical Analysis of Metals (Withdrawn 1997)

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