MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2005

Publisher

British Standards Institution

INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
5 Standard ratings
6 Marking
7 General notes on tests
8 Dimensions and construction
9 Electrical requirements
10 Standard sheets
Annex A (informative) - Mounting for surface mount fuse-links
Bibliography
Annex ZA (normative) - Normative references to international
Publications with their corresponding
European publications

Deals with universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors.

Committee	PEL/32
DevelopmentNote	Supersedes 94/202200 DC, 90/34345 DC and 99/201800 DC. (02/2003) Supersedes 02/210447 DC. (06/2005) Supersedes 00/202832 DC. (11/2005) Supersedes 05/30137140 DC. (04/2009) 2005 Edition Re-Issued in July 2013 & incorporates AMD 2 2013. 2005 + A1 2009 Edition is still active & will be withdrawn on 11-01-2016. (07/2013)
DocumentType	Standard
Pages	36
PublisherName	British Standards Institution
Status	Current
Supersedes	05/30137140 DC : 0 94/202200 DC : DRAFT MAR 1994 02/210447 DC : DRAFT OCT 2002 90/34345 DC : JAN 91 99/201800 DC : DRAFT APR 1999 00/202832 DC : DRAFT JULY 2000

Standards	Relationship
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV	Identical
DIN EN 60127-4 : 2013	Identical
SN EN 60127-4 : 2005	Identical
EN 60127-4:2005/A2:2013	Identical
NF EN 60127-4 : 2005 AMD 2 2013	Identical
I.S. EN 60127-4:2005	Identical
NBN EN 60127-4 : 2006 AMD 2 2013	Identical
UNE-EN 60127-4:2006	Identical

BS 1075:1989

Specification for tungsten halogen lamps (non vehicle)

HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 60127-1:2006/A2:2015	MINIATURE FUSES - PART 1: DEFINITIONS FOR MINIATURE FUSES AND GENERAL REQUIREMENTS FOR MINIATURE FUSE-LINKS
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
ISO 3:1973	Preferred numbers Series of preferred numbers
IEC 60127-1:2006+AMD1:2011+AMD2:2015 CSV	Miniature fuses - Part 1: Definitions for miniature fuses andgeneral requirements for miniature fuse-links
EN 61249-2-7:2002/corrigendum:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
EN 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 60664-1:2007	Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
IEC 60115-8:2009	Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
IEC 60326-3:1991	Printed boards - Part 3: Design and use of printed boards
IEC 60664-1:2007	Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 60115-1:2008	Fixed resistors for use in electronic equipment - Part 1: Generic specification

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BS EN 60127-4 : 2005

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Abstract

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International Equivalents

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