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BS EN 60512-12-3:2006

Current

Current

The latest, up-to-date edition.

Connectors for electronic equipment. Tests and measurements Soldering tests - Solderability, de-wetting

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

03-30-2007

Foreword
1 Scope and object
2 Normative references
3 Applicability
4 Preparations
5 Method
6 Details to be specified
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.

Committee
EPL/48
DevelopmentNote
Supersedes 02/209660 DC. (04/2006)
DocumentType
Standard
Pages
8
PublisherName
British Standards Institution
Status
Current
Supersedes

IEC 60512-12-1:2006 Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
IEC 60512-12-2:2006 Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 60512-12-2:2006/corrigendum Dec. 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD
IEC 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
EN 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
EN 60512-12-1:2006 Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method

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