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BS EN 60749-3:2017

Current
Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods External visual examination
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

11-24-2017

Publisher

British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report form/checklist
        (example only - not a mandatory template)
Bibliography
Annex ZA (normative) - Normative references to international
         Publications with their corresponding
         European publications

Describes the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.

The purpose of this part of IEC60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.

Committee
EPL/47
DevelopmentNote
Supersedes 00/203562 DC. (09/2002) Supersedes BS EN 60749. (09/2005) Supersedes 16/30344800 DC. (11/2017)
DocumentType
Standard
Pages
18
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
I.S. EN 60749-3:2017 Identical
DIN EN 60749-3:2003-04 Identical
UNE-EN 60749-3:2003 Identical
IEC 60749-3:2017 Identical
NBN EN 60749-3 : 2003 Identical
NF EN 60749-3 : 2002 Identical
EN 60749-3:2017 Identical

EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

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PDF - English
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