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BS EN 61189-5:2006

BS EN 61189-5:2006

Current

Current

The latest, up-to-date edition.

Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies

Published date

02-28-2009

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's t distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
   5.1 Test 5P01: Test-board design guideline
   5.2 Test 5P02: Standard mounting process
         for CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
   8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
   9.1 Test 5M01: Peel test method for test-board land
10 E: Electrical test methods
   10.1 Test 5E01: Changes of the surface
         insulation resistance caused by fluxes
   10.2 Test 5E02: Surface insulation resistance,
         assemblies
11 N: Environmental test methods
   11.1 Test 5N01: Reflow solderability test for
         soldering joint
   11.2 Test 5N02: Resistance to reflow solderability
         of test board
   11.3 Test 5N03: Solderability test for test board land
12 X Miscellaneous test methods
   12.1 Test 5X01: Liquid flux activity, wetting
         balance method
   12.2 Test 5X02: Paste flux viscosity - T-Bar
         spindle method
   12.3 Test 5X03: Spread test, liquid or extracted
         solder flux, solder paste and extracted
         cored wires or preforms
   12.4 Test 5X04: Solder paste viscosity - T-Bar
         spin spindle method (applicable to 300 Pa.s
         to 1600 Pa.s)
   12.5 Test 5X05: Solder paste viscosity - T-Bar
         spindle method (applicable to 300 Pa.s)
   12.6 Test 5X06: Solder paste viscosity - Spiral
         pump method (applicable to 300 Pa.s
         to 1600 Pa.s)
   12.7 Test 5X07: Solder paste viscosity - Spiral
         pump method (applicable to Pa.s)
   12.8 Test 5X08: Solder paste - Slump test
   12.9 Test 5X09: Solder paste - Solder ball test
   12.10 Test 5X10: Solder paste - Tack test
   12.11 Test 5X11: Solder paste - Wetting test
   12.12 Test 5X12: Flux residues - Tackiness
         after drying
   12.13 Test 5X13: Spitting of flux-cored wire
         solder
   12.14 Test 5X14: Solder pool test
Bibliography
Annex ZA (normative) - Normative references to
                       international publications with
                       their corresponding European
                       publications

Describes test methods representing methodologies and procedures that can be applied to test printed board assemblies.

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

Committee
EPL/501
DocumentType
Standard
PublisherName
British Standards Institution
Status
Current

Standards Relationship
IEC 61189-5:2006 Identical
EN 61189-5 : 2006 Identical

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
EN 62137:2004/corrigendum:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
ISO 5725-2:1994 Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
ISO 9001:2015 Quality management systems — Requirements
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 29455-1:1993 Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:1990)
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IPC TR 467 : 0 SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
EN ISO 9455-2:1995 Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993)

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