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BS EN 62435-1:2017

Current
Current

The latest, up-to-date edition.

Electronic components. Long-term storage of electronic semiconductor devices General
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

08-18-2017

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms definitions and abbreviated terms
4 Purpose of long-term storage
5 Logistics
6 Storage considerations for devices after
   card (or other) attachment
7 Handling
8 Inspection
9 Inventory control process
10 Transportation
11 Lead finishes
12 Kitting and lot control
13 Validation
14 Unplanned storage and types of storage
15 Other things to store in addition to the components
16 Storage facility
17 Policies
18 Legislation and environmental issues
Annex A (informative) - Example checklist for project
        managers
Annex B (normative) - Example checklist for long-term
        storage facilities
Annex C (informative) - Example of a component list
Annex D (informative) - Examples of periodic and/or
        de-stocking tests
Annex E (informative) - Parameters influencing the
        quantity of components to be stored
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy.

IEC62435-1:2017 on long-term-storage covers the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy. Long-term storage refers to a duration that can be more than 12 months for products scheduled for long duration storage. Philosophy, good working practice, and general means to facilitate the successful long-term-storage of electronic components are also addressed.
This standard cancels and replaces IEC/PAS 62435 published in 2005. This first edition constitutes a technical revision.

Committee
EPL/47
DevelopmentNote
Supersedes 13/30286159 DC. (08/2017)
DocumentType
Standard
Pages
40
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 62435-1:2017 Identical

IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC TS 62668-1:2016 Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC TS 61945:2000 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC 62402:2007 Obsolescence management - Application guide
GEIA STD 0016 : 2012 PREPARING A DMSMS MANAGEMENT PLAN
IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN 190000:1995 Generic Specification: Monolithic integrated circuits

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