Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

05-07-2014

Publisher

British Standards Institution

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

Committee	EPL/501
DocumentType	Standard
Pages	96
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC TR 62866:2014	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-3-6:2001	Environmental testing - Part 3-6: Supporting documentation and guidance - Confirmation of the performance of temperature/humidity chambers
IEC 60749-4:2017	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
MIL-HDBK-781 Revision A:1996	RELIABILITY TEST METHODS, PLANS, AND ENVIRONMENTS FOR ENGINEERING DEVELOPMENT, QUALIFICATION AND PRODUCTION
IEC 60068-2-66:1994	Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0	TEST METHODS MANUAL
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IEC 60068-2-67:1995	Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
IEC 60068-2-38:2009	Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
ISO 4677-1:1985	Atmospheres for conditioning and testing Determination of relative humidity Part 1: Aspirated psychrometer method
IPC TR 476 : A1997	ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES
IEC 60068-3-5:2001	Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
ISO 9455-17:2002	Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
IEC 60068-2-2:2007	Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IPC 9201 : A	SURFACE INSULATION RESISTANCE HANDBOOK
MIL-STD-690 Revision D:2005	Failure Rate (FR) Sampling Plans and Procedures
ASQ Z1.9:2003 (R2013)	Sampling Procedures And Tables For Inspection By Variables For Percent Nonconforming
IEC 60068-2-30:2005	Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)