Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-31-2013

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirement
Annex A (informative) - Guidance on control levels,
        risk assessment, and mitigation evaluation
Annex B (informative) - Technical guide on detection
        methods, mitigation methods, and methods for
        limiting impact of tin
Annex C (informative) - Tin whisker inspection
Annex D (informative) - Analysis and risk assessment
        guidance
Annex E (informative) - Whiskers growing from solder
        joint fillets and bulk solder
Bibliography

Gives processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

This document may be used by other high-performance and high-reliability industries, at their discretion.

Committee	GEL/107
DocumentType	Standard
Pages	72
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC PAS 62647-2:2011	Identical
IEC TS 62647-2:2012	Identical

IEC PAS 62647-3:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
MIL-I-46058 Revision C:1972	Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
IEC TS 62239-1:2015	Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-23:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
MIL-STD-1580 Revision B:2003	DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
IEC TS 62647-1:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
IEC PAS 62647-21:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

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PD IEC/TS 62647-2:2012

Current

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

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