This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead -free (Pb-free) electronics to assure product reliability and performance .

Manufacturers of Aerospace, Defence and High Performance (ADHP) electronics may inadvertently introduce Pb -free elements (including piece part finish, printed wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful coordina tion between buyer and supplier is not exercised . For example, piece part manufacturers may not always change part numbers to identify Pb -free finishes, especially if the previous tin -lead (Sn-Pb) finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection , while crucial, may not be sufficient to identify Pb -free piece parts.

NOTE 1 Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations . The industry conversion to Pb -free solder technology may affect an ADHP program in one or both of the following ways:

• i f the program is required to implement Pb -free technology (contract requirement, environmental regulation, etc), then the program manager/lead systems engineer will need to assess the impact of in -house transition with respect to design (performance of products using Pb -free) and process (processes to build Pb -free products);

• i f the program purchases COTS ( commercial-off-the-shelf) items for its products/systems, then there is a very good chance that these items will contain Pb -free solder or Pb -free finishes on parts, printed wiring boards (PWBs), printed circuit boards (PCB), or circuit cards assemblies (CCA).

The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerosp ace and/or high performance program . The annexes in the document describe tools that can be used in conjunction with this document.

• A nnex A describes a matrix of product tier level versus associated risks with respect to a Pb-free transition.

• A nnex B contains links to the European Union Directives and Executive Order 13148.

• A nnex C contains a general program manager checklist for dealing with Pb-free issues that summarizes the content of this document.

• A nnex D contains a general manufacturing process assessment checklist to assess supplier compliance to IEC/TS 62647-1.

• A nnex E describes a recommended program language to assure performance, reliability, airworthiness, safety, and certifiability of Pb-free product(s).

This document is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with IEC/TS 62647-1. Please note that the program manager and systems engineer (along with their respective organizations), and the appropriate enterprise authority work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. For the purposes of this document, “p rogram management (or manager) and/or systems engineering management (or manager) and/or the appropriate enterprise authority ?? are defined as “program manager ??.

NOTE 2 T he implications are that the program manager and systems engineering manager (along with their respective organizations) and the appropriate enterprise authority work together in ensuring that all impacts of Pb - free technology insertion are understood and risks mitigated accordingly. This document may be used by other high performance and high reliability industries at their discretion.