CECC 75101-807 : 1994

Name: CECC 75101-807 : 1994
Brand: CECC

Withdrawn

MODULAR TWO-PART CONNECTORS FOR PRINTED BOARDS AND BACKPLANES, GRIDOF 2.5 mm - ACCORDING TO IEC 917 (DETAIL SPECIFICATION)

Withdrawn date

06-02-2016

Published date

01-12-2013

Publisher

Cenelec Electronic Components Committee

Foreword
Preface
1 General data
  1.l Recommended method of mounting
  1.2 Minimum and maximum number of contacts
  1.3 Ratings and characteristics
  1.4 Related documents
  1.5 Marking
  1.6 Ordering Information
2 Characteristics
  2.1 Climatic category
  2.2 Electrical
  2.3 Mechanical
3 Dimensional information
  3.1 Drawings and dimensions
4 Test schedule
  4.1 General
  4.2 Test schedule tables
5 Quality assessment procedures
  5.1 Qualification approval testing
  5.2 Quality conformance inspection
  5.3 Delayed delivery, re-inspection
ANNEX A (normative): Test phase BP3.2: Corrosion,
                     industrial atmosphere

Gives detail specification for modular two-part connectors for printed boards and backplanes, grid of 2.5 mm, according to IEC 60917.

Committee	SR 48B
DocumentType	Standard
PublisherName	Cenelec Electronic Components Committee
Status	Withdrawn

Standards	Relationship
I.S. CECC 75101-807:1994	Identical

EN 175100 : 1992	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: TWO PART AND EDGE SOCKET CONNECTORS FOR PRINTED BOARD APPLICATIONS
IEC 60512-8:1993	Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60512-6:1984	Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
IEC 60512-7:1993	Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
IEC 60352-1:1997	Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance
IEC 60410:1973	Sampling plans and procedures for inspection by attributes
ISO 468:1982	Surface roughness — Parameters, their values and general rules for specifying requirements
IEC 60352-5:2012	Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
IEC 60512-4:1976	Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
IEC 60512-9:1992	Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests
IEC 60512-5:1992	Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
IEC 60512-1:2001	Connectors for electronic equipment - Tests and measurements - Part 1: General
IEC 60326-3:1991	Printed boards - Part 3: Design and use of printed boards
IEC 60512-3:1976	Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests