CEI EN 61709 : 2012
Current
The latest, up-to-date edition.
Hardcopy , PDF
English
01-01-2012
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (normative) - Failure modes of components
Annex B (informative) - Thermal model for semiconductors
Annex C (informative) - Failure rate prediction
Annex D (informative) - Considerations on mission profile
Annex E (informative) - Useful life models
Annex F (informative) - Physics of failure
Annex G (informative) - Considerations for the design of a
data base on failure rates
Annex H (informative) - Potential sources of failure rate
data and methods of selection
Annex I (informative) - Overview of component classification
Annex J (informative) - Presentation of component reliability
data
Annex K (informative) - Examples
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
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