MIL-STD-883 Revision K:2016
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TEST METHOD STANDARD - MICROCIRCUITS
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IPC J STD 026 : 0
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SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
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ISO/IEC 11179-3:2013
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Information technology — Metadata registries (MDR) — Part 3: Registry metamodel and basic attributes
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EN 62258-2:2011
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SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
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IEC 61340-5-1:2016
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Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
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MIL-PRF-19500 Revision P:2010
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SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
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EIA 554 : 1996
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METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM)
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MIL-PRF-38534 Revision J:2015
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HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
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IEC TR 61340-5-2:2007
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Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
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IEC 60749-27:2006+AMD1:2012 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
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IEC 62258-5:2006
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Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
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FED-STD-209 Revision E:1992
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AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
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IPC J STD 033C-1:2014
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HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
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IPC J STD 012 : 0
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IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
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IEC TR 62258-8:2008
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Semiconductor die products - Part 8: EXPRESS model schema for data exchange
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IEC 61360-1:2017
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Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods
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CLC/TR 62258-8:2008
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Semiconductor die products - Part 8: EXPRESS model schema for data exchange
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CLC/TR 62258-3:2007
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Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
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IEEE 1076-2008 REDLINE
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IEEE Standard VHDL Language Reference Manual
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EN 62258-6 : 2006
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SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
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IEC 60749-26:2013
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
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EN 62258-5 : 2006
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SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
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IEC TR 62258-7:2007
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Semiconductor die products - Part 7: XML schema for data exchange
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ISO 8879:1986
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Information processing Text and office systems Standard Generalized Markup Language (SGML)
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IEC 62258-2:2011
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Semiconductor die products - Part 2: Exchange data formats
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IEC TR 62258-3:2010
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Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
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ISO 14644-1:2015
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Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
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IEC 62258-6:2006
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Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
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ISO 9000:2015
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Quality management systems — Fundamentals and vocabulary
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IPC J STD 028 : 0
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PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
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IEC 60191-4:2013
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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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CLC/TR 62258-4:2013
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Semiconductor die products - Part 4: Questionnaire for die users and suppliers
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IEC TR 62258-4:2012
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Semiconductor die products - Part 4: Questionnaire for die users and suppliers
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EIA 557 : 2006
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STATISTICAL PROCESS CONTROL SYSTEMS
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EN ISO 14644-1:2015
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Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015)
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CLC/TR 62258-7:2007
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Semiconductor die products - Part 7: XML schema for data exchange
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