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CEI EN 62258-1 : 2011

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2011

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers
   with or without connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-47. (08/2006) Supersedes ES 59008-1:1999-09, ES 59008-2:1999-09 and ES 59008-3:1999-09. (08/2006)
DocumentType
Standard
Pages
52
PublisherName
Comitato Elettrotecnico Italiano
Status
Current
Supersedes

Standards Relationship
IEC 62258-1:2009 Identical
EN 62258-1:2010 Identical

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IEC TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
ISO 8879:1986 Information processing Text and office systems Standard Generalized Markup Language (SGML)
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
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