EIA 540FAAB : 92(R1998)

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DETAIL SPECIFICATION FOR MULTI-PACKAGE 100 MIL PITCH, ANGLED MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT

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Published date: 01-12-2013

Publisher: JEDEC Solid State Technology Association

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Applicable to sockets for Multi-Package Modules, angled mounting, 2.54mm (0.100 in) pad pitch, having 2.54mm (0.100 in) lead spacing. Provides all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi-Package Module Sockets for the NECQ quality system.

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Published
Document Type	Standard
Status	Current
Publisher	JEDEC Solid State Technology Association
Development Note	Stabilized: April 2013. (07/2015)
Pages
ISBN
Committee	CE-3.0

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EIA 540FAAB : 92(R1998)

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