Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)

Published date

08-29-1994

Publisher

European Committee for Standards - Electrical

Foreword
Clause
1. Scope
2. General description
3. Description of test apparatus
4. Severities
5. Initial measurements
6. Testing
7. Intermediate measurements
8. Recovery
9. Final measurements
10. Information to be given in the relevant specification
Annexes
A. Steam table
B. Physical significance of the test
C. Determination of humidity
D. Test apparatus and handling

Provides a standard test procedure for the prupose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects, such as corrosion and deformation. Has the status of a basic safety publication in accordance with IEC Guide 104.

Committee	CLC/SR 104
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NF EN 60068 2-66 : 1995	Identical
BS EN 60068-2-66:1995	Identical
CEI EN 60068-2-66 : 1997	Identical
NEN 10068-2-66 : 1994	Identical
UNE-EN 60068-2-66:1997	Identical
I.S. EN 60068-2-66:1995	Identical
SN EN 60068-2-66 : 1994	Identical
PN EN 60068-2-66 : 1999	Identical
IEC 60068-2-66:1994	Identical
NBN EN 60068 2-66 : 1995	Identical
DIN EN 60068-2-66:1995-06	Identical

BS EN 60674-3-8 : 2011	PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011)
BS EN IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 60068-2-69:2017	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
EN 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
EN 62878-1-1:2015	Device embedded substrate - Part 1-1: Generic specification - Test methods
VDE 0468-2-69 : 2018	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
CEI EN 60674-3-8 : 2012	PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
DIN EN 60068-2-69 : 2007	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
OVE/ONORM EN 60068-2-20 : 2009	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
BS EN 62878-1-1:2015	Device embedded substrate Generic specification. Test methods
CEI EN 61189-5-503 : 1ED 2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS EN 60068-2-20:2008	Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-69:2017/AC:2018-03	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
I.S. EN 60068-2-20:2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
BS EN 60068-2-69:2017	Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
CEI EN 60068-2-69 : 2008	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
I.S. EN 60674-3-8:2011	PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
I.S. EN 61189-5-503:2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
CEI EN 60068-2-20 : 2009	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60674-3-8:2011/A1:2017	PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011/A1:2016)