MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

Publisher

Government Electronics & Information Technology Association

Foreword
Introduction
1 Scope
2 Terms and Definitions
3 Requirements
4 Implementation Methods
Annex A - Guidance on Control Levels, Risk Assessment,
          and Mitigation Evaluation
Annex B - Technical Guide on Detection Methods,
          Mitigation Methods, and Methods for Limiting Impact
          of Pb-free Tin Finishes
Annex C - Tin Whisker Inspection
Annex D - Analysis and Risk Assessment Guidance
Annex E - Whiskers Growing from Solder Joint Fillets
          and Bulk Solder
Annex F - Bibliography

Specifies processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems.

Committee	G-12
DocumentType	Standard
Pages	79
PublisherName	Government Electronics & Information Technology Association
Status	Current

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IEC TS 62239-1:2015	Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
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NASA JSC 66491 : 2013	STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
IEC TS 62647-1:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
SAE AS 12500 : 2018	CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
IEC PAS 62647-21:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
PD IEC/TS 62239-1:2015	Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan
IEC TS 62647-23:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
PD IEC/TS 62647-23:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC TS 62647-22:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
PD IEC/TS 62647-3:2014	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
DD IEC PAS 62647-3 : DRAFT SEP 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
PD IEC/TS 62647-22:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines