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I.S. EN 60191-6-5:2002

I.S. EN 60191-6-5:2002

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
          publications with their corresponding European
          publications

Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
18
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
NF EN 60191-6-5 : 2002 Identical
IEC 60191-6-5:2001 Identical
UNE-EN 60191-6-5:2002 Identical
BS EN 60191-6-5:2001 Identical
EN 60191-6-5:2001 Identical
DIN EN 60191-6-5:2002-05 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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Hardcopy - English
PDF - English
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