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I.S. EN 60749-16:2003

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PARTICLE IMPACT NOISE DETECTION (PIND)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance (for guidance)
8 Detail specification
9 Summary
Bibliography

Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
26
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
UNE-EN 60749-16:2003 Identical
DIN EN 60749-16:2003-09 Identical
NBN EN 60749-16 : 2004 Identical
IEC 60749-16:2003 Identical
BS EN 60749-16:2003 Identical
EN 60749-16:2003 Identical
NF EN 60749-16 : 2003 Identical

IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements

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PDF - English
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