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I.S. EN 60749-25:2003

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary
Figure 1 - Representative temperature profile for
           thermal cycle test conditions

Specifies a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
40
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
UNE-EN 60749-25:2004 Identical
BS EN 60749-25:2003 Identical
EN 60749-25:2003 Identical
NF EN 60749-25 : 2003 Identical
DIN EN 60749-25:2004-04 Identical
SN EN 60749-25 : 2003 Identical
NBN EN 60749-25 : 2004 Identical
IEC 60749-25:2003 Identical

IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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