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ANSI Y14.5 : 1973
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DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
|
|
IPC T 50 : M
|
TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
|
|
IEC 61182-2:2006
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
|
|
IEC 61188-5-3:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
|
|
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
|
|
IPC 2582 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
|
|
IEC 61188-5-8:2007
|
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
|
|
DOD STD 100 : C NOTICE 6
|
ENGINEERING DRAWING PRACTICES
|
|
IPC D 325 : A
|
DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
|
|
IPC 2584 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
|
|
ISO 10303-212:2001
|
Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation
|
|
IPC 2614 : 0
|
SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
|
|
IPC 2583 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
|
|
ANSI Z210.1 : LATEST
|
METRIC PRACTICE GUIDE
|
|
IPC 7351 : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
|
|
IPC 2615 : 0
|
PRINTED BOARD DIMENSIONS AND TOLERANCES
|
|
IPC 2511 : B
|
GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
|
|
IPC 2588 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
|
|
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
|
IPC D 310 : C
|
GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
|
|
IEC 61188-5-6:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
|
|
IEC 61188-5-1:2002
|
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
|
|
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions
|
|
IEC 61188-5-5:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
|
|
IPC 2501 : 0
|
DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
|
|
ISO 10303-210:2011
|
Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
|
|
IEC 61188-5-4:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
|
|
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
|
|
EN 60194:2006
|
Printed board design, manufacture and assembly - Terms and definitions
|
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