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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2008

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
Annex A (informative) - Worked examples
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Describes methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	128
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 61189-3:2008	Identical
NF EN 61189-3 : 2013	Identical
BS EN 61189-3:2008	Identical
IEC 61189-3:2007	Identical
SN EN 61189-3 : 1997 AMD 1 1999	Identical
DIN EN 61189-3:2008-06	Identical
NBN EN 61189-3 : 2008	Identical

HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 61188-1-2:1998	Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
EN 60454-3-1:1998/A1:2001	PRESSURE-SENSITIVE ADHESIVE TAPES FOR ELECTRICAL PURPOSES - SPECIFICATIONS FOR INDIVIDUAL MATERIALS - PVC FILM TAPES WITH PRESSURE-SENSITIVE ADHESIVE
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
EN 62326-4-1:1997	Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
EN 61188-1-2:1998	Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
IEC 60454-1:1992	Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements
IEC 60454-3-1:1998+AMD1:2001 CSV	Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
EN ISO 9002:1994/AC:1997	QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
IEC 61189-1:1997+AMD1:2001 CSV	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
IEC 62326-4:1996	Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
EN ISO 9453:2014	Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 60584-1:2013	Thermocouples - Part 1: EMF specifications and tolerances
EN 60454-1:1994	Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements
ISO 4046:1978	Paper, board, pulp and related terms — Vocabulary
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
EN 60068-2-78:2013	Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
IEC 62326-4-1:1996	Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
EN 61189-1 : 97 AMD 1 2001	TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
EN 62326-4:1997	Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
EN 60695-11-5:2017	Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
IEC 60695-11-5 : 2.0	FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 60584-1:2013	Thermocouples - Part 1: EMF specifications and tolerances

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I.S. EN 61189-3:2008

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)

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Abstract

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