IAPMO IGC 215 : 2005B(R2014)
Current
Current
The latest, up-to-date edition.
SOLDER-LESS BONDING ADHESIVE FOR COPPER PIPING WATER SYSTEMS
Available format(s)
Hardcopy
Language(s)
English
Published date
02-25-2014
Includes minimum standards for the manufacture and performance of solderless bonding adhesive for copper piping water systems and is intended to prescribe minimum test performance and test requirements for solderless bonding adhesive for copper piping water systems.
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