IEC 60068-2-58:2015+AMD1:2017 CSV
Current
Current
The latest, up-to-date edition.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Amended by
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, English - French
Published date
07-28-2017
Publisher
IEC 60068-2-58:2015+A1:2017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition:
- the addition of Sn-Bi low temperature solder alloy;
- the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
- introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
- implementation of guidance for the choice of a test severity in Clause B.3.
This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2022. (08/2017)
|
| DocumentType |
Standard
|
| Pages |
73
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| BS EN 60068-2-58 : 2015 | Identical |
| NF EN 60068-2-58 : 2015 | Identical |
| NEN EN IEC 60068-2-58 : 2015 | Identical |
| CEI EN 60068-2-58 : 2016 | Identical |
| VDE 0468-2-58 : 2016 | Identical |
| OVE/ONORM EN 60068-2-58 : 2016 | Identical |
| NBN EN 60068 2-58 : 2015 | Identical |
| DIN IEC 60068-2-58 : 1992 | Corresponds |
| UNE-EN 60068-2-58:2006 | Identical |
| EN 60068-2-58:2015/A1:2018 | Identical |
| PN EN 60068-2-58 : 2015 | Identical |
| DIN EN 60068-2-58 : 2016 | Identical |
| SN EN 60068-2-58 : 1999 | Identical |
| CEI 50-8/5 : 1ED 1999 | Identical |
| NFC 20 758 : 1990 | Identical |
| UNE 20501-2-58:1994 | Identical |
| 13/30283837 DC : 0 | BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE |
| BS CECC 00802:1991 | Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality |
| BS EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality Generic specification |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| 16/30353588 DC : 0 | BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 61188-5-5:2007 | Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides |
| NF EN 60393-5 : 2016 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 5: SECTIONAL SPECIFICATION - SINGLE-TURN ROTARY LOW-POWER WIREWOUND AND NONWIREWOUND POTENTIOMETERS |
| 02/206181 DC : DRAFT MAY 2002 | IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 170000:1999 | Harmonized system of quality assessment for electronic components. Generic specification: waveguide type dielectric resonators |
| 12/30258507 DC : 0 | BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| 05/30138794 DC : DRAFT SEP 2005 | |
| 17/30357139 DC : 0 | BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| NF EN 60512-16-21 : 2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| BS EN 62575-1:2016 | Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality Generic specification |
| I.S. EN 62604-1:2015 | SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| DSCC 09024 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402 |
| 15/30325282 DC : 0 | BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| BS EN 171000:2001 | Harmonized system of quality assessment for electronic components. Generic specification. Filters using waveguide type dielectric resonators |
| BS EN 61338-2:2004 | Waveguide type dielectric resonators Guidelines for oscillator and filter applications |
| I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
| 10/30240248 DC : 0 | BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61248-1:1997 | Transformers and inductors for use in electronic and telecommunication equipment Generic specification |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| DSCC 09027 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210 |
| BS EN 60539-1:2016 | Directly heated negative temperature coefficient thermistors Generic specification |
| 04/30112662 DC : DRAFT APR 2004 | IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
| 14/30315320 DC : 0 | BS EN 60384-15 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE |
| BS EN 60738-1-2:2008 | Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Heating element application. Assessment level EZ |
| BS EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement |
| NF EN 60384-1 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 03/104227 DC : DRAFT MAY 2003 | IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
| 06/30155911 DC : DRAFT SEP 2006 | BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| 17/30355848 DC : 0 | BS EN 60384-22 ED.3.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
| BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
| 02/206102 DC : DRAFT MAY 2002 | IEC 60384-21, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 1 - ASSESSMENT LEVEL EZ |
| 05/30132097 DC : DRAFT JUNE 2005 | IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61051-1:2008 | Varistors for use in electronic equipment Generic specification |
| I.S. EN 60384-18:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
| BS EN 60738-1-1:2008 | Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Current limiting application. Assessment level EZ |
| CEI EN 60068-2-21 : 2006 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| DSCC 11018 : 0 | INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603 |
| NF EN 62674-1 : 2013 | HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
| CEI EN 62211 : 2005 | INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| CEI EN 61760-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| I.S. EN 61051-1:2008 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61810-7:2006 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
| I.S. EN 60738-1-4:2008 | THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ |
| OVE/ONORM EN 61051-1 : 2009 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| IEC 62391-1:2015 | Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
| I.S. EN 62575-1:2016 | RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60539-1:2016 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61248-1:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| NF EN 62391-1 : 2018 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| PD IEC/TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 62211:2017 | Inductive components - Reliability management |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| EN 60738-1-3:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ |
| EN 60738-1-1:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ |
| IEC 60384-1:2016 RLV | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| EN 60384-22:2012 | Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 |
| EN 61337-1:2004 | Filters using waveguide type dielectric resonators - Part 1: Generic specification |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 60738-1-2:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ |
| EN 61019-1 : 2005 | Surface acoustic wave (SAW) resonators - Part 1: Generic specification |
| EN 60384-18:2016 | Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| EN 60384-3:2016 | Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO2) electrolyte |
| EN 60127-4:2005/A2:2013 | Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
| EN 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| EN 60539-2:2004/A1:2010 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| EN 60738-1-4:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ |
| EN 60068-2-44:1995 | Environmental testing - Part 2: Tests - Guidance on Test T: Soldering |
| EN 61051-1:2008 | Varistors for use in electronic equipment - Part 1: Generic specification |
| NF EN 62025-2 : 2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| EN 60738-1:2006/A1:2009 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| EN 62604-1:2015 | Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification |
| EN 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 140402:2015/A1:2016 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| EN 62674-1 : 2012 | HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012) |
| EN 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| A-A-59532-1 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING |
| A-A-59532-6 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, TIME DELAY |
| A-A-59532-4 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY, WITH A FUSEHOLDER, BLOCK |
| A-A-59532-3 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY |
| A-A-59532-5 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, QUICK ACTING |
| A-A-59532-2 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING WITH FUSEHOLDER, BLOCK |
| BS EN 61337-1:2004 | Filters using waveguide type dielectric resonators Generic specification |
| I.S. EN IEC 60810:2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| CEI EN 60512-12-3 : 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
| 10/30237986 DC : 0 | BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| 09/30214333 DC : 0 | BS EN 60384-22 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
| 06/30157868 DC : 0 | BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| DSCC 09023 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201 |
| NF EN 61189-3-719 : 2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
| 12/30252220 DC : DRAFT MAR 2012 | BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION |
| BS EN 60384-21:2012 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| BS EN 60115-8:2012 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
| 15/30332490 DC : 0 | BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| I.S. EN 60384-25:2015 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| BS EN 62211:2004 | Inductive components. Reliability management |
| 07/30165180 DC : 0 | BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
| BS EN 60512-12-1:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests - Test 12a. Solderability, wetting, solder bath method |
| 05/30129049 DC : DRAFT FEB 2005 | IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| 03/103741 DC : DRAFT FEB 2003 | IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61810-7:2006 | Electromechanical elementary relays Test and measurement procedures |
| I.S. EN 60738-1-1:2008 | THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-1: BLANK DETAIL SPECIFICATION - CURRENT LIMITING APPLICATION - ASSESSMENT LEVEL EZ |
| 07/30161526 DC : 0 | BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| CSA E60384.1 : 2014 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60068-2-83:2011 | Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| BS EN 60738-1-3:2008 | Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Inrush current application. Assessment level EZ |
| BS EN 60747-5-5 : 2011 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
| NF EN 61020-1 : 2009 | ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 02/206104 DC : DRAFT MAY 2002 | IEC 60384-22, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 2 - ASSESSMENT LEVEL EZ |
| IEC 61051-1:2007 | Varistors for use in electronic equipment - Part 1: Generic specification |
| BS EN 62674-1:2012 | High frequency inductive components Fixed surface mount inductors for use in electronic and telecommunication equipment |
| 09/30186180 DC : 0 | BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| 09/30207307 DC : 0 | BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
| I.S. EN 61337-1:2005 | FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60384-21:2012 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 (IEC 60384-21:2011 (EQV)) |
| CEI EN 60393-1 : 2010 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| I.S. EN 60384-1:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 60115-8-1:2014 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60384-1 REDLINE : 5ED 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 140402:2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| IEC TR 60068-3-12:2014 | Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile |
| CEI EN 60384-21 : 2013 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
| CEI EN 60512-12-1 : 2007 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
| I.S. EN 61019-1:2005 | SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
| I.S. EN 60115-8:2012 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
| I.S. EN 60512-12-1:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, |
| I.S. EN 62674-1:2012 | HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV)) |
| IEC 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
| BS EN 60539-2 : 2004 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| I.S. EN 60068-2-82:2007 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| I.S. EN 140401:2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60127-4 : 2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
| I.S. EN 60068-2-83:2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
| IEC 60539-1:2016 | Directly heated negative temperature coefficient thermistors - Part 1: Generic specification |
| I.S. EN 60384-22:2012 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 (IEC 60384-22:2011 (EQV)) |
| I.S. EN 60512-12-4:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| CEI EN 60384-22 : 2013 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2 |
| I.S. EN 60393-6:2016 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
| I.S. EN 61189-3-719:2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
| I.S. EN 60368-1:2000 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| EN 60384-25:2015 | Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with conductive polymer solid electrolyte |
| I.S. EN 61188-5-4:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| IEC 60738-1-3:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ |
| IEC 61338-2:2004 | Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
| OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| CEI EN 60068-3-13 : 1ED 2017 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| BS EN 60738-1-4:2008 | Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Sensing application. Assessment level EZ |
| BS EN 60393-6:2016 | Potentiometers for use in electronic equipment Sectional specification. Surface mount preset potentiometers |
| BS EN 62137:2004 | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| BS EN 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification |
| 13/30287806 DC : 0 | BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| 06/30153438 DC : DRAFT JULY 2006 | BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION |
| CEI EN 62421 : 2008 | ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
| 11/30252855 DC : 0 | BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
| CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| 14/30312344 DC : 0 | PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
| 97/231700 DC : DRAFT DEC 1997 | IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 13/30289547 DC : 0 | BS EN 60384-18 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO2) AND NON-SOLID ELECTROLYTE |
| NF EN 60068-2-83 : 2012 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
| BS EN 61019-1:2005 | Surface acoustic wave (SAW) resonators Generic specification |
| DSCC 11017 : 0 | INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402 |
| DSCC 11019 : 0 | INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805 |
| BS EN 140401-801 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| 04/30113172 DC : DRAFT MAY 2004 | IEC 60384-24 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| I.S. EN 61337-2:2004 | FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
| BS EN 60068-2-54:2006 | Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| BS EN 62025-2:2005 | High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics |
| BS EN 60368-1:2000 | Piezoelectric filters Generic specification |
| 09/30209389 DC : 0 | BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
| CEI EN 60368-1 : 2006 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
| 17/30355844 DC : DRAFT JUL 2017 | BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
| I.S. EN 61188-5-3:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES |
| BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
| BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
| BS EN 61338-1:2005 | Waveguide type dielectric resonators Generic specification |
| 09/30214329 DC : 0 | BS EN 60384-21 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION: FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 |
| BIS IS/IEC 60862-1 : 2003 | SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61188-5-8:2008 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) |
| 04/30113200 DC : DRAFT MAY 2004 | IEC 60384-25 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| BS EN 60512-16-21:2012 | Connectors for electronic equipment. Tests and measurements Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses |
| BS EN 60384-25:2015 | Fixed capacitors for use in electronic equipment Sectional specification. Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte |
| 16/30338234 DC : 0 | BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
| 06/30155905 DC : DRAFT SEP 2006 | BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| 15/30329267 DC : 0 | BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
| 14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| BS EN 60512-12-3:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests - Solderability, de-wetting |
| CEI EN 62884-1 : 1ED 2018 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| DSCC 09026 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805 |
| IEC 61338-1-2:1998 | Waveguide type dielectric resonators - Part 1-2: General information and test conditions - Test conditions |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| BS EN 140402 : 2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 140401-804:2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| I.S. EN 61188-5-6:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
| BS EN 60384-24:2015 | Fixed capacitors for use in electronic equipment Sectional specification. Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte |
| I.S. EN 60384-24:2015 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| I.S. EN 61338-1:2005 | WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
| BS EN 140401-804 : 2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| I.S. EN 60512-12-3:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
| BS EN 140401:2009 | Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
| NF EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 62884-1:2017 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| I.S. EN 62211:2017 | INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| CEI EN 60068-2-83 : 2012 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
| NF EN 60393-6 : 2016 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
| I.S. EN 60393-1:2009 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC PAS 60747-17:2011 | Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation |
| I.S. EN 60068-2-54:2006 | ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 61188-5-8:2008 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA) |
| IEC 60393-1:2008 | Potentiometers for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| EN 61760-4:2015/A1:2018 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
| NF EN 60539-2 : 2005 AMD 1 2011 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| IEC 60368-1:2000+AMD1:2004 CSV | Piezoelectric filters of assessed quality - Part 1: Genericspecification |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV | Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
| IEC 60384-24:2015 | Fixed capacitors for use in electronic equipment - Part 24: Sectional specification - Fixed tantalum electrolytic surface mount capacitors with conductive polymer solid electrolyte |
| IEC 60539-2:2003+AMD1:2010 CSV | Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors |
| IEC 60512-12-3:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting |
| IEC 60393-6:2015 | Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers |
| IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| IEC 61337-1:2004 | Filters using waveguide type dielectric resonators - Part 1: Generic specification |
| IEC 60068-2-83:2011 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| IEC 62575-1:2015 | Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification |
| EN 140401-804:2011/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| EN 61007:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
| 02/203178 DC : 0 | PREN 140101-806 - DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE WOUND RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS - ASSESSMENT LEVEL Z - VERSION A: WITH 100-%-TEST - VERSION E: WITH FAILURE RATE LEVEL AND 100-%-TEST - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| I.S. EN 61188-5-5:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES |
| BS EN 62604-1:2015 | Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality Generic specification |
| 12/30260802 DC : 0 | BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 07/30149142 DC : 0 | BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| NF EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| NF EN 61051-1 : 2013 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| DSCC 09025 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603 |
| 03/103740 DC : DRAFT FEB 2003 | IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| 12/30260691 DC : 0 | BS EN 60384-24 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| 14/30280850 DC : 0 | BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 08/30186808 DC : DRAFT JULY 2008 | BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60068-3-13:2016 | Environmental testing Supporting documentation and guidance on Test T. Soldering |
| BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| CEI EN 60384-18 : 2007 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| BS PD ISO/IEC PAS 60127-8 : 2014 | MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| BS EN 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
| CEI EN 61051-1 : 2010 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 61007:1997 | Transformers and inductors for use in electronic and telecommunication equipment. Measuring methods and test procedures |
| BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| 12/30260721 DC : 0 | BS EN 60384-25 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 25: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| 06/30149145 DC : DRAFT OCT 2006 | IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60068-2-82:2007 | Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
| BS EN 61337-2:2004 | Filters using waveguide type dielectric resonators Guide for use |
| BS EN 60122-1 : 2002 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 60384-18:2016 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic surface mount capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte |
| BS EN 60068-2-20:2008 | Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads |
| BS EN 61760-4 : 2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| I.S. EN 60539-2:2004 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| NF EN 60384-18 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
| I.S. EN 60738-1:2006 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62137:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| IEC 62391-1:2015 RLV | Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
| EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles - Performance requirements |
| I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 60068-3-13:2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| I.S. EN 60068-2-20:2008 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| I.S. EN 60747-5-5:2011 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
| CEI EN 60068-2-54 : 2007 | ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| I.S. EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV)) |
| EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| CEI EN 61810-7 : 2006 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
| IEC 61337-1-2:1999 | Filters using waveguide type dielectric resonators - Part 1-2: Test conditions |
| I.S. EN 61020-1:2009 | ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| I.S. EN 62391-1:2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| IEC 61007:1994 | Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 60539-1:2016/AC:2017-09 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 16/30350012 DC : 0 | BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| IEC 60738-1:2006+AMD1:2009 CSV | Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification |
| BS EN 61188-5-6:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides |
| IEC 60384-3:2016 | Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO<sub>2</sub>) electrolyte |
| IEC 62604-1:2015 | Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification |
| IEC 60747-5-5:2007+AMD1:2013 CSV | Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| EN 60512-12-3:2006/corrigendum Dec. 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING |
| IEC 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 60384-25:2015 | Fixed capacitors for use in electronic equipment - Part 25: Sectional specification: Fixed aluminium electrolytic surface mount capacitors with conductive polymer solid electrolyte |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| IEC 60384-18:2016 | Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte |
| IEC 60738-1-4:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
| IEC 61248-1:1996 | Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification |
| IEC 60512-16-21:2012 | Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses |
| IEC 60738-1-1:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
| IEC 60384-21:2011 | Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 |
| IEC 62391-1 : 2.0 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 61019-1:2004 | Surface acoustic wave (SAW) resonators - Part 1: Generic specification |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| IEC 61338-1:2004 | Waveguide type dielectric resonators - Part 1: Generic specification |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60384-22:2011 | Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 |
| IEC 62674-1:2012 | High frequency inductive components - Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 62025-2:2005 | High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics |
| IEC 60738-1-2:2008 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ |
| IEC 61337-2:2004 | Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
| IEC 60512-12-4:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method |
| EN 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
| EN 61337-2:2004 | Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
| EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
| I.S. EN 61007:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
| 10/30237992 DC : DRAFT NOV 2010 | BS IEC 60393-6 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
| BS EN 60512-12-4:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12d. Resistance to soldering heat, solder bath method |
| I.S. EN 60738-1-3:2008 | THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ |
| BS EN 60738-1 : 2006 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| 09/30210454 DC : DRAFT SEP 2009 | BS EN 60512-16-21 - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| BS 9752:1989 | Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level |
| BS EN 60384-22:2012 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 |
| DD IEC/PAS 60747-17:2011 | Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation |
| 12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| 11/30243576 DC : DRAFT FEB 2011 | BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| BS EN 62421:2007 | Electronics assembly technology. Electronic modules |
| CEI EN 62391-1 : 2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60393-1:2009 | Potentiometers for use in electronic equipment Generic specification |
| CEI EN 60068-2-82 : 2008 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| CEI EN 140401 : 2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| 12/30261600 DC : DRAFT MAR 2012 | BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| CEI EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| BS EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment Generic specification |
| UNE-EN 61020-1:2011 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| 10/30219044 DC : 0 | BS EN 62674-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| IEEE C62.33-1982 | IEEE Standard Test Specifications for Varistor Surge-Protective Devices |
| I.S. EN 62025-2:2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| PD IEC/TR 60068-3-12:2014 | Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile |
| BS EN 60384-3:2006 | Fixed capacitors for use in electronic equipment Sectional specification: Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte |
| I.S. EN 60068-2-44:1997 | ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
| BS EN 61188-5-3:2007 | Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides |
| CEI EN 60539-1 : 2009 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| I.S. EN 60127-4:2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
| I.S. EN 60384-3:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) ELECTROLYTE |
| I.S. EN 60122-1:2002 AMD 1 2018 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60862-1:2015 | SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61811-1:2015 | ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
| CEI EN 60122-1 : 2004 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61760-4:2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| BS EN 60068-2-21:2006 | Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices |
| I.S. EN 60068-2-21:2006 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| NF EN 60127-4 : 2005 AMD 2 2013 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
| CEI EN 60068-2-20 : 2009 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| CEI EN 60512-16-21 : 2013 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| CEI EN 60512-12-4 : 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| NF EN 60747-5-5 : 2012 AMD 1 2015 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS |
| CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 60738-1-2:2008 | THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ |
| NF EN 60068-2-82 : 2013 | ENVIRONMENTAL TESTING - PART 2-82 : TESTS - TEST XW1 : WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| I.S. EN 140401-801:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
| EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| EN 60747-5-5:2011/A1:2015 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS (IEC 60747-5-5:2007/A1:2013) |
| EN 140401-801:2007/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| EN 60384-24:2015/AC:2017-01 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 24: SECTIONAL SPECIFICATION - SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE (IEC 60384-24:2015/COR1:2016) |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61810-7:2006 | Electromechanical elementary relays - Part 7: Test and measurement procedures |
| IEC 60512-12-1:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| EN 61188-5-8:2008 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| EN 62211:2017 | Inductive components - Reliability management |
| EN 61338-2:2004 | Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
| EN 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
| EN 61248-1 : 1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 60122-1:2002/A1:2018 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60122-1:2002/A1:2017) |
| EN 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| EN 60393-6:2016 | Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers |
| EN 60368-1:2000/A1:2004 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| EN 60115-8:2012 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| EN 60068-2-83 : 2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011) |
| EN 61810-7:2006 | Electromechanical elementary relays - Part 7: Test and measurement procedures |
| EN 62575-1:2016 | Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
| EN 60384-21:2012 | Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| OVE/ONORM EN 62025-2 : 2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| EN 60512-12-4:2006/corrigendum:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| EN 62391-1:2016/AC:2016-12 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016) |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 61188-5-4 : 2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| EN 61338-1:2005 | Waveguide type dielectric resonators - Part 1: Generic specification |
| EN 60512-12-1:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method |
| EN 62025-2:2005 | High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics |
| EN 60393-1:2009 | Potentiometers for use in electronic equipment - Part 1: Generic specification |
| EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC TR 60068-3-12:2014 | Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile |
| IEC 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61249-2-35:2008 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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PDF 9 Users - English - French
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