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IEC 60512-6-2:2002

Current
Current

The latest, up-to-date edition.

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

02-21-2002

Foreword
1 General
2 Preparation of the specimen
3 Test method
4 Measurements
5 Details to be specified

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

Committee
TC 48/SC 48B
DevelopmentNote
Stability Date: 2017. (10/2012)
DocumentType
Standard
Pages
9
PublisherName
International Electrotechnical Committee
Status
Current

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