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IEC 60664-3 REDLINE : 3ED 2016

Current
Current

The latest, up-to-date edition.

INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
Published date

11-14-2016

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Design requirements
5 Tests
Annex A (normative) - Test sequences
Annex B (normative) - Decisions to be taken by
        the technical committees
Annex C (normative) - Printed wiring board for
        testing coatings
Bibliography

Pertains to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664-1.

Committee
TC 109
DevelopmentNote
Stability Date: 2021. (11/2016)
DocumentType
Standard
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
UNE-EN 60664-3:2018 Identical

IEC 60454-3-1:1998+AMD1:2001 CSV Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
ISO/IEC Guide 51:2014 Safety aspects Guidelines for their inclusion in standards
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC GUIDE 104:2010 The preparation of safety publications and the use of basic safety publications and group safety publications
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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