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IEC 60747-14-1:2010

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

01-21-2010

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terminology, units, letter symbols, terms and
  definitions
4 Standard environmental conditions
5 Marking
6 Quality assessment procedures
7 Test and measurement procedures
Annex A (normative) - Sampling procedures
Bibliography

IEC 60747-14-1:2009 describes general items concerning the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors. Sensors described in this standard are basically made of semiconductor materials, however, the statements made in this standard are also applicable to sensors using materials other than semiconductor, for example dielectric and ferroelectric materials. The major changes with regard to the previous edition are as follows: a) Title change from "Semiconductor sensors - General and classification" to "Semiconductor sensors - Generic specification for sensors"; b) Clause 3 has been divided into three Clauses 3, 4 and 5; c) Added new terms from IEC 60747-14-5; d) Added a new Clause relating to Quality assessment procedures; e) Added a Bibliography; f) Added a new Annex for the sampling procedure.

Committee
TC 47/SC 47E
DevelopmentNote
Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
42
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
BS IEC 60747-14.1 : 2010 Identical
NEN IEC 60747-14-1 : 2010 Identical
BS IEC 60747-14-1:2010 Identical
PN IEC 60747-14-1 : 2003 Identical

CEI EN 62047-9 : 2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
17/30355780 DC : DRAFT SEP 2017 BS EN 60747-18-2 - SEMICONDUCTOR DEVICES - PART 18-2: SEMICONDUCTOR BIO SENSORS - EVALUATION PROCESS OF LENS-FREE CMOS PHOTONIC ARRAY SENSOR PACKAGE MODULE
07/30172404 DC : DRAFT DEC 2007 BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
BS IEC 60747-14-5:2010 Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor
BS ISO 19614:2017 Traditional Chinese medicine. Pulse graph force transducer
16/30301330 DC : 0 BS ISO 19614 - TRADITIONAL CHINESE MEDICINE - PULSE GRAPH FORCE TRANSDUCER
BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
ISO 19614:2017 Traditional Chinese medicine — Pulse graph force transducer
ISO 23552-1:2007 Safety and control devices for gas and/or oil burners and gas and/or oil appliances — Particular requirements — Part 1: Fuel/air ratio controls, electronic type
BS IEC 60747-14.3 : 2009 SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS
IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
I.S. EN 62047-9:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
07/30164953 DC : 0 IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR
08/30181404 DC : DRAFT APR 2008 BS IEC 60747-14-3 - SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC 60721-2-1:2013 Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 60721-3-0:1984+AMD1:1987 CSV Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60721-3-1:1997 Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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