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IEC 60747-15:2010

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

12-16-2010

Publisher

International Electrotechnical Committee

IEC 60747-15:2010 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices. The main changes with respect to previous edition are listed below.
a) Clause 3, 4 and 5 were re-edited and some of them were combined to other sub clauses.
b) Clause 6, 7 were re-edited as a part of "Measuring methods" with amendment of suitable addition and deletion.
c) Clause 8 was amended by suitable addition and deletion.
d) Annex C, D and Bibliography were deleted.


This publication is to be read in conjunction with IEC 60747-1:2006.

Committee
TC 47/SC 47E
DevelopmentNote
To be read in conjunction with IEC 60747-1. (12/2010) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
54
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

BS EN 61287-1:2014 Railway applications. Power converters installed on board rolling stock Characteristics and test methods
UNE-EN 61287-1:2015 Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods
04/30114936 DC : DRAFT JUN 2004 EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES
I.S. EN 61287-1:2014 RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS
IEC 61287-1:2014 Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods
EN 61287-1:2014/AC:2014 RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS (IEC 61287-1:2014)

IEC 60112:2003+AMD1:2009 CSV Method for the determination of the proof and the comparative tracking indices of solid insulating materials
IEC 60270:2000+AMD1:2015 CSV High-voltage test techniques - Partial discharge measurements
IEC 60747-7:2010 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
IEC 61287-1:2014 Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60747-9:2007 Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)
IEC 60747-8:2010 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60747-6:2016 Semiconductor devices - Part 6: Discrete devices - Thyristors
IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 60747-2:2016 Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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Hardcopy - English
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PDF 3 Users - English - French
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