IEC 60748-11:1990
Current
The latest, up-to-date edition.
Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-20-1990
FOREWORD
PREFACE
Clause
1 Scope
2 General
2.1 Related documents
2.2 Recommended values of temperatures
2.3 Recommended values of voltages
2.4 Definitions related to manufacturing operations
3 Subcontracting
4 Primary stage of manufacture
4.1 Bipolar devices
4.2 Unipolar devices
5 Quality assessment procedures
5.1 Qualification approval procedures
5.2 Capability approval procedures
6 Structural similarity procedures
6.1 General rules
6.2 Test dependent criteria for structural similarity
- Table I
7 Groups and sub-groups
Table II - Group A: Lot by lot
Table III - Group B: Lot by lot
Table IV - Group C: Periodic tests
Table V - Group D
8 Screening
Table VI - Screening
9 Sampling requirements
Table VII - Sampling requirements for Group A tests
Table VIII - Sampling requirements for Group B, C
and D tests in which LTPD shall be used
10 Terminal identification
11 Additional information (under consideration)
12 Test and measurement procedures
12.1 Electrical measuring methods
12.2 Mechanical and climatic test methods
12.3 Electrical endurance tests
12.4 Accelerated test procedures
12.5 Correlated measurements
APPENDIX A - Guidance and format for drafting blank
detail specifications
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