IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Semiconductor devices - Mechanical and climatic test methods
Amended by
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
08-19-2004
Language(s)
English - French
Published date
04-10-2002
Publisher
Foreword
Chapter 1: General
1 Scope and object
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 External visual examination and verification of dimensions
6 Electrical measurements
Chapter 2: Mechanical Test Methods
1 Robustness of terminations
1.1 Tensile
1.2 Bending
1.3 Torsion
1.4 Torque
2 Soldering
2.1 Solderability
2.2 Resistance to soldering heat
2.3 Resistance of plastic encapsulated SMDs to the
combined effect of moisture and soldering heat
3 Vibration (sinusoidal)
4 Shock
5 Acceleration, steady state
6 Bond strength test
6.1 General
6.2 Methods A and B
6.3 Method C
6.4 Method D
6.5 Methods E and F
6.6 Method G
6.7 Information to be given in the relevant specification
7 Die shear strength test
7.1 Object
7.2 Description of the test apparatus
7.3 Test method
7.4 Failure criteria
7.5 Requirements
7.6 Information to be given in the relevant specification
Chapter 3: Climatic Test Methods
1 Change of temperature
1.1 Rapid change of temperature: two-chamber method
1.2 Rapid change of temperature: two-fluid-bath method
2 Storage (at high temperature)
3 Low air pressure
4A Damp heat, steady state
4B Damp heat. steady state, accelerated
4C Damp heat, steady state, highly accelerated
5 Sealing
5.1 General terms
5.2 Bomb pressure test
5.3 Fine leak detection: radioactive krypton method
5.4 Fine leak detection: tracer gas (helium) method
with mass spectrometer
5.5 Gross leaks, perfluorocarbon vapour method using
electronic detection apparatus
5.6 Gross leak - Perfluorocarbon - bubble detection
method
5.7 Test condition E, weight-gain gross-leak detection
5.8 Penetrant dye gross leak detection
5.9 Gross leak re-test
6 Salt mist
7 Thermal intermittence test
8 Internal moisture content measurement by mass spectrometry
method
8.1 Object
8.2 General description
8.3 Test apparatus
8.4 Preconditioning
8.5 Conditioning
8.6 Requirements
8.7 Information to be given in the relevant specification
8.8 Guidance
Chapter 4: Miscellaneous Test Methods
1 Flammability tests of plastic-encapsulated devices
1.1 Flammability (internally induced)
1.2 Flammability (externally induced)
2 Permanence of marking
Annex A (normative) Guidance
Figures
Tables
Lists test methods applicable to semiconductor devices (discrete devices and integrated circuits) from which a selection may be made.Establishes uniform preferred test methods with preferred values for stress levels for judging the environmental properties of semiconductor devices.
| Committee |
TC 47
|
| DevelopmentNote |
Also numbered as BS EN 60749 (10/2001) Supersedes IEC PAS 62207, IEC PAS 62190 and IEC PAS 62191 (03/2002) Supersedes IEC 60147-5A. (07/2004)
|
| DocumentType |
Standard
|
| Pages |
151
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749 : 99 AMD 2 2002 | Identical |
| NEN EN IEC 60749 : 99 AMD 2 2002 | Identical |
| NEN 10749 : 1997 | Identical |
| I.S. EN 60749:1944 | Identical |
| PN EN 60749 : 2003 | Identical |
| SN EN 60749 : 1999 AMD 1 2000 | Identical |
| UNE 20699:1992 | Identical |
| BIS IS 12641 : 2004 | Identical |
| CEI EN 60749 : 2000 AMD 2 2004 | Identical |
| EN 60749 : 99 AMD 2 2001 | Identical |
| DIN EN 60749:2002-09 | Identical |
| DIN IEC 60749:1987-09 | Identical |
| UNE EN 60749 : 2000 A2 2002 | Identical |
| 11/30234042 DC : 0 | BS EN 62595-1-1 ED.1 - LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION |
| BS CECC 265001:1998 | Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits |
| BS QC 720102:1997 | Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems |
| BS IEC 62679-1-1:2014 | Electronic paper displays Terminology |
| 04/30112662 DC : DRAFT APR 2004 | IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
| BS IEC 60748-2.11 : 1999 | SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR SINGLE SUPPLY INTEGRATED CIRCUIT, ELECTRICALLY ERASABLE, AND PROGRAMMABLE READ-ONLY MEMORY |
| 03/117620 DC : DRAFT NOV 2003 | IEC 60747-1 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL |
| BS QC 750111:1991 | Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A |
| BS 6493-2.1:1985 | Semiconductor devices. Integrated circuits General |
| BS QC750116(2000) : 2000 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
| BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
| BS QC750100(1986) : 1986 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION |
| IEC 60300-3-7:1999 | Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware |
| IEC 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| EN 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| EN 190102:1994 | Family Specification: TTL-Schottky digital integrated circuits - Series 54S, 64S, 74S, 84S |
| EN 61643-321:2002 | Components for low-voltage surge protective devices - Part 321: Specifications for Avalanche Breakdown Diode (ABD) |
| BS CECC 90202:1990 | Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated operational amplifiers |
| BS EN 61751:1998 | Laser modules used for telecommunication. Reliability assessment |
| BS EN 61747-5:1998 | Liquid crystal and solid-state display devices Environmental, endurance and mechanical test methods |
| 11/30241341 DC : DRAFT JAN 2011 | BS EN 62149-7 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 7: 1310 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
| BS EN 190101:1994 | Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits series 54, 64, 74, 84 |
| 12/30244653 DC : 0 | BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
| BS IEC 60747-4.2 : 2000 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
| CEI EN 61643-341 : 2002 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 341: SPECIFICATION FOR THYRISTOR SURGE SUPPRESSOR (TSS) |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| BS IEC 60300-3.7 : 1999 | DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE |
| BS IEC 60748-11:2000 | Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| CEI EN 61643-321 : 2003 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 321: SPECIFICATIONS FOR AVALANCHE BREAKDOWN DIODE (ABD) |
| CEI EN 61747-1 : 2004 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| IEC 61747-1-1:2014 | Liquid crystal display devices - Part 1-1: Generic - Generic specification |
| IEC 60748-2-12:2001 | Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs) |
| IEC 60747-4-2:2000 | Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification |
| OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| BS CECC 90201:1990 | Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated voltage regulators |
| I.S. EN 61751:1999 | LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| 08/30181401 DC : DRAFT APR 2008 | BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
| BS QC 790109:1992 | Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU |
| BS EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies Terminal assemblies |
| 11/30252972 DC : 0 | BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| 02/205627 DC : DRAFT APR 2002 | IEC 60747-14-4. ED.1.0 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS |
| BS IEC 60748-23-1:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
| 05/30137514 DC : DRAFT AUG 2005 | IEC 60747-14-4 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS |
| BS IEC 60748-2.12 : 2001 | SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR PROGRAMMABLE LOGIC DEVICES (PLDS) |
| BS QC790100(1991) : 1991 AMD 10586 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
| IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
| IEC 60747-5-4:2006 | Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers |
| IEC 62679-1-1:2014 | Electronic paper displays - Part 1-1: Terminology |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| I.S. EN 61747-5:1999 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| EN 61643-341:2001 | Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) |
| 09/30192488 DC : 0 | BS EN 62595 ED.1 - MEASUREMENT METHODS OF LED BACKLIGHT UNIT FOR LIQUID CRYSTAL DISPLAYS |
| 12/30268616 DC | BS EN 61747-1-1. Liquid crystal display devices. Generic. Generic specification |
| BS EN 61643-321:2002 | Low voltage surge protective devices Specifications for avalanche breakdown diode (ABD) |
| 11/30252977 DC : 0 | BS EN 61747-10-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - ENVIRONMENTAL AND ENDURANCE |
| BS EN 61643-341:2001 | Low voltage surge protective devices Specification for thyristor surge suppressors (TSS) |
| BS QC 720104:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems |
| BS EN 190103:1994 | Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY, circuits, series 54LS, 64LS, 74LS, 84LS |
| BS EN 190102:1994 | Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84S |
| 17/30340372 DC : 0 | BS EN 62906-5-1 ED 1.0 - LASER DISPLAY DEVICES - PART 5-1: MEASUREMENT OF OPTICAL PERFORMANCE FOR LASER FRONT PROJECTION |
| 11/30252924 DC : 0 | BS EN 60747-5-6 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-6: OPTOELECTRONIC DEVICES - LIGHT EMITTING DIODES |
| BS QC 790202:1991 | Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Monolithic integrated operational amplifiers |
| BS EN 61747-1:2000 | Liquid crystal and solid-state display devices Generic specification |
| I.S. EN 165000-1:1998 | FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
| I.S. EN 61192-4:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
| IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| IEC 61643-321:2001 | Components for low-voltage surge protective devices - Part 321: Specifications for avalanche breakdown diode (ABD) |
| IEC 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| 09/30183239 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| DIN EN 190000:1996-05 | GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS |
| BS QC 750000(1986) : 1986 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION |
| BS IEC 60747-5-4:2006 | Semiconductor devices. Discrete devices Optoelectronic devices. Semiconductor lasers |
| IEC 60747-4-1:2000 | Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification |
| 07/30148822 DC : 0 | BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS |
| BIS IS 15934-5 : 2011 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| CEI 56-44 : 2000 | DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE |
| IEC 61643-341:2001 | Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) |
| EN 61747-1:1999/A1:2003 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| EN 165000-1:1996 | Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 60653:1979 | General considerations on ultrasonic cleaning |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
| IEC 60068-2-47:2005 | Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
| IEC 60068-2-48:1982 | Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
US$800.00
Excluding Tax where applicable
USD
CAD
CHF
CNY
DKK
EUR
GBP
HKD
IDR
INR
JPY
KRW
MXN
NOK
NZD
SEK
SGD
USD
ZAR
Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.