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IEC 60749-25:2003

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

07-11-2003

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62178. (07/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2020. (11/2017)
DocumentType
Standard
Pages
25
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

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