IEC 61188-5-8:2007

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 BGA (square)
  4.1 Field of application
  4.2 Component descriptions
      4.2.1 Basic construction
      4.2.2 Termination materials
      4.2.3 Marking
      4.2.4 Carrier package format
      4.2.5 Process considerations
  4.3 Component dimensions (square)
      4.3.1 PBGA 1,5 mm pitch component dimensions (square)
      4.3.2 PBGA 1,27 mm pitch component dimensions (square)
      4.3.3 PBGA 1,00 mm pitch component dimensions (square)
  4.4 Solder joint fillet design
      4.4.1 Solder joint fillet design - Non-collapsing,
            collapsing (level 3)
  4.5 Land pattern dimensions
      4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square)
      4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square)
      4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
  6.1 Field of application
  6.2 Component descriptions
      6.2.1 Basic construction
      6.2.2 Termination materials
      6.2.3 Marking
      6.2.4 Carrier package format
      6.2.5 Process considerations
  6.3 Component dimensions (rectangular)
  6.4 Solder joint fillet design
      6.4.1 Solder joint fillet design - Collapsing (level 3)
      6.4.2 Land approximation
      6.4.3 Total variation
  6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Bibliography