Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

05-02-2019

Publisher

International Electrotechnical Committee

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

Committee	TC 91
DocumentType	Standard
ISBN	978-2-8322-6866-7
Pages	81
ProductNote	THIS STANDARD ALSO REFERS TO IPC-A-610F, IPC-2221B
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
UNE-EN IEC 61188-6-4:2019	Identical
OVE EN IEC 61188-6-4: 2020 05 01	Identical
I.S. EN IEC 61188-6-4:2019	Identical
CEI EN IEC 61188-6-4 : 2019	Identical
EN IEC 61188-6-4:2019	Identical
PN-EN IEC 61188-6-4 : 2019-10	Identical
BS EN IEC 61188-6-4:2019	Identical
NEN-EN-IEC 61188-6-4:2019	Identical
NF EN IEC 61188-6-4:2019	Identical