IEC 61189-5-503:2017
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
05-22-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing condition
5 Specimen
6 Equipment/Apparatus or material
7 Resistance measurement method
8 Test method
9 Procedure
Annex A (informative) - Forms of electrochemical migration
Bibliography
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