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IEC 61192-3:2002

IEC 61192-3:2002

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

Available format(s)

Hardcopy , PDF

Withdrawn date

12-31-2021

Language(s)

English - French

Published date

12-17-2002

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection techniques
   4.4 Interpretation of requirements
5 Component preparation processes
   5.1 Lead forming
   5.2 Lead protrusion and clinching
   5.3 Lead cutting/cropping
   5.4 Pre-tinning
6 Masking attributes
   6.1 Misalignment
   6.2 Improper adhesion
   6.3 Thermal capability
7 Insertion of through-hole components
   7.1 General requirements
   7.2 Orientation and mounting criteria
   7.3 Missing component
   7.4 Wrong component
   7.5 Damaged component
8 Soldering process attributes
   8.1 General requirements
   8.2 Misalignment
   8.3 Damaged components
   8.4 Solder joint characteristics
9 Cleaning attributes
   9.1 Flux residues
   9.2 Other residues
10 Rework/replacement attributes
Figures
Tables

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

DevelopmentNote
To be used in conjunction with IEC 61192-1, IEC 61192-2 and IEC 61192-4. (12/2002) Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
93
PublisherName
International Electrotechnical Committee
Status
Withdrawn

IEC 60294:2012 Measurement of the dimensions of a cylindrical component with axial terminations
BS EN 60115-2:2015 Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors
EN 60115-2:2015 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
IEC 60115-2:2014 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
BS EN 60717:2012 Method for the determination of the space required by capacitors and resistors with unidirectional terminations
BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
BS EN 60068-2-82:2007 Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components
BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
BS EN 60294:2012 Measurement of the dimensions of a cylindrical component with axial terminations
BS 6221-25:2000 Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies
97/206324 DC : DRAFT MAY 1997
97/230541 DC : DRAFT AUG 1997
NF EN 60068-2-82 : 2013 ENVIRONMENTAL TESTING - PART 2-82 : TESTS - TEST XW1 : WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 60717:2012 Method for the determination of the space required by capacitors and resistors with unidirectional terminations
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
IEC 60717:2012 Method for the determination of the space required by capacitors and resistors with unidirectional terminations
EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
EN 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
EN 60294:2012 Measurement of the dimensions of a cylindrical component with axial terminations
IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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Hardcopy - English - French
PDF - English - French
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