Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

11-28-2018

Publisher

International Electrotechnical Committee

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Committee	TC 47/SC 47A
DocumentType	Standard
ISBN	978-2-8322-6291-7
Pages	28
ProductNote	THIS STANDARD ALSO REFERS TO IEC 63011-1, IEC 63011-3
PublisherName	International Electrotechnical Committee
Status	Current