IEC 63055:2016

Superseded

View Superseded by

Format for LSI-Package-Board Interoperable design

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

10-11-2023

Language(s)

English

Published date

11-08-2016

Publisher

International Electrotechnical Committee

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

Committee	TC 91
DevelopmentNote	Also numbered as IEEE 2401. Stability Date: 2021. (11/2016)
DocumentType	Standard
Pages	194
PublisherName	International Electrotechnical Committee
Status	Superseded
SupersededBy	IEC 63055:2023

Standards	Relationship
BS IEC 63055:2016	Identical

IEEE 1364-2005	IEEE Standard for Verilog Hardware Description Language
IEC 62433-2:2017	EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
IEC 62433-4:2016	EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
IEEE 1076-2008 REDLINE	IEEE Standard VHDL Language Reference Manual
IEC 62433-3:2017	EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)