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IEC TS 62647-21:2013

Current
Current

The latest, up-to-date edition.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

07-26-2013

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 General discussion of program management/systems
   engineering management concerns
5 Requirements definition
6 Use environment(s)
7 Decision criteria
8 Supplier's lead-free control plan
9 Requalification/test plan
10 Rework/repair and maintenance
11 Risk management
12 Cost
13 Presentation to customer
Annex A (informative) - Matrix of tier level
        versus associated risk
Annex B (informative) - Links to the European Union
        Directives and Executive Order 13148
Annex C (informative) - General program manager
        checklist for dealing with Pb-free issues
Annex D (informative) - General manufacturing process
        assessment checklist for assessing supplier
        compliance to IEC/TS 62647-1
Annex E (informative) - Recommended program language
        (subject to contractual agreements)
Bibliography

IEC/TS 62647-21:2013(E) is designed to assist program management and/or systems engineering management in managing the transition to lead-free electronics to assure product reliability and performance. The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerospace and/or high performance program. The annexes in the document describe tools that can be used in conjunction with this document. This document is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with IEC/TS 62647-1.

DevelopmentNote
Supersedes IEC PAS 62647-21. (08/2013) Stability date: 2019. (11/2017)
DocumentType
Technical Specification
Pages
34
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
PD IEC/TS 62647-21:2013 Identical

IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
PD IEC/TS 62647-3:2014 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines

GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
ASQ Q9000:2005 Quality Management Systems - Fundamentals And Vocabulary
GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

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