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IPC 2581 : B

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
Available format(s)

Hardcopy

Superseded date

02-05-2021

Language(s)

English

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 CONTENT
5 LOGISTIC HEADER
6 HISTORY RECORD
7 BOM (Material List)
8 ELECTRONIC COMPUTER AIDED DESIGN (ECAD)
9 APPROVED VENDOR LIST (AVL)
10 GLOSSARY
11 REFERENCE INFORMATION
Appendix A - IPC-7351 Naming Convention for Land Patterns
Appendix B - Panel Instance File
Appendix C - Potential Reference Designator Assignment
             for Non Electrical Items

Describes the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.

Committee
2-10
DevelopmentNote
Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
0
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
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BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC 2588 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
IPC 2583 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
IPC 2582 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
IPC 7525 GERMAN : B STENCIL DESIGN GUIDELINE
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
IPC 7525 CHINESE : B STENCIL DESIGN GUIDELINES
EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 2584 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC 7525 : B STENCIL DESIGN GUIDELINES
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))

ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC 2611 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION
DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
IPC 2578 : 0 SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
ISO 10303-212:2001 Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation
IPC 2614 : 0 SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
IPC 2576 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION OF AS-BUILT PRODUCT DATA - PRODUCT DATA EXCHANGE (PDX)
IPC 2511 : B GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC 2571 : 2001 GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX)
IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
ISO 10303-210:2011 Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

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Hardcopy - English
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