DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES

Available format(s)

Hardcopy

Language(s)

English

Published date

07-01-2006

Publisher

Institute of Printed Circuits

1 SCOPE
  1.1 Purpose
  1.2 Terms and Definitions
2 APPLICABLE DOCUMENTS
  2.1 IPC
3 PWB FABRICATION AND ASSEMBLY GUIDELINES
  3.1 Advantages of Via Protection
  3.2 PWB Fabrication Issues
      3.2.1 Fill or Plug Separation from Plated Hole
            Wall
      3.2.2 Voids
  3.3 Assembly Process Issues
  3.4 Long Term Reliability Concerns
4 MATERIALS/DESIGN CONSIDERATIONS
  4.1 End Use Considerations
  4.2 Fabrication Considerations
  4.3 Assembly Considerations
  4.4 Types of Materials for Filled/Plugged
      4.4.1 Non-conductive (Organic) - Non-imageable
      4.4.2 Non-conductive - Photoimageable
      4.4.3 Conductive Ink
  4.5 Materials for Tented/Covered Via Structures
      4.5.1 Tented Only
      4.5.2 Tented and Covered
  4.6 Material Specification and Selection
5 VIA PROTECTION DEFINITIONS AND TYPES
  5.1 Tented Via (Type I Via)
  5.2 Tented and Covered Via (Type II Via)
  5.3 Plugged Via (Type III Via)
  5.4 Plugged and Covered Via (Type IV Via)
  5.5 Filled Via (Type V Via)
  5.6 Filled and Covered Via (Type VI Via)
  5.7 Filled and Capped Via (Type VII Via)
  5.8 Partially Filled Via
6 PERFORMANCE TRADEOFFS
  6.1 Planarity
  6.2 Via Metallization
  6.3 Moisture Absorption
  6.4 Cleanliness Concerns
  6.5 Use of Conformal Coating
7 SAMPLE DESIGNS
8 EXAMPLES OF DRAWING NOTES

Provides PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping.

Committee	D-30
DevelopmentNote	Included in IPC C 106. Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType	Standard
Pages	22
PublisherName	Institute of Printed Circuits
Status	Current

IPC 2221 GERMAN : B	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 7092 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC 7093 CHINESE : -	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC HDBK 840 : 0	SOLDER MASK HANDBOOK
IPC 7351 GERMAN : B	Basic requirements for SMT design and SMD patch guideline
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012	GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC S 100 : LATEST	STANDARDS AND SPECIFICATIONS MANUAL
IPC E 500 : LATEST	IPC ELECTRONIC DOCUMENT COLLECTION
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC M 105 : LATEST	RIGID PRINTED BOARD MANUAL
IPC M 106 : LATEST	TECHNOLOGY REFERENCE FOR DESIGN MANUAL
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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