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IPC 5702 : 0

Current
Current

The latest, up-to-date edition.

GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
Available format(s)

Hardcopy

Language(s)

English

Published date

06-01-2007

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Joint Industry Standards
  2.3 Telcordia
  2.4 Radio Technical Commission for Aeronautics
3 THE PROBLEM WITH UNDERSTANDING CLEANLINESS DATA
  3.1 Where to Start
4 LAB TESTS
5 ENVIRONMENTAL STRESS SCREENING (ESS) TESTING
6 SUGGESTED APPROACH
7 SUMMARY
Appendix A - ROSE TESTING

Covers many aspects of how cleanliness is measured on printed boards, as well as many critical factors to consider when specifying board cleanliness in purchasing documents.

Committee
5-30
DevelopmentNote
Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008)
DocumentType
Standard
Pages
24
PublisherName
Institute of Printed Circuits
Status
Current

EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
MIL-STD-810 Revision G:2008 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC TR 476 : A1997 ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES
IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IPC TR 583 : 0 AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
IPC 5701 : 0 USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS

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