IPC 7711/21 : B

Superseded

View Superseded by

REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES

Available format(s)

Hardcopy

Superseded date

02-05-2021

Language(s)

English

Publisher

Institute of Printed Circuits

Describes procedures for repairing and reworking printed board assemblies.

DevelopmentNote	Supersedes IPC R 700, IPC 7711 and IPC 7721. (05/2016) B2007 Edition is still available in Chinese, Czech, German, Danish, French, Hungarian, Italian, Korean, Polish, Romanian, Russian, Spanish, Swedish & Turkish languages, See separate records. (02/2017) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	360
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 7711/21C : 2017
Supersedes	IPC 7711/21 : A IPC 7721 : 1998 IPC 7711/21 SPANISH : B IPC 7711 : 1998 IPC 7711/21 ITALIAN : B IPC R 700 : C1988

IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 850 : 0	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 7351 GERMAN : B	Basic requirements for SMT design and SMD patch guideline
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL STD 11991 : A	GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IEC PAS 62647-23:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
NASA KSC E 165 : 2009	ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
CSA N290.14 : 2015	QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS
IPC J STD 030 : A	SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
IEC TS 62647-23:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
PD IEC/TS 62647-23:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES