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IPC 9202 : 0

IPC 9202 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE

Available format(s)

Hardcopy

Superseded date

11-15-2022

Language(s)

English

Publisher

Institute of Printed Circuits

1 Scope/Introduction
2 APPLICABLE DOCUMENTS
3 TEST SPECIMENS
4 SAMPLE SIZES
5 APPARATUS AND MATERIALS
6 PROCESSING OF TEST VEHICLES
7 SPECIMEN PREPARATION FOR TESTING
8 TEST METHODOLOGY
9 ACCEPTANCE CRITERIA
10 REPORTING
11 NOTES
12 HELPFUL REFERENCES

Explains changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.

DevelopmentNote
Included in IPC C 103, IPC C 108 & IPC C 1000. (11/2011)
DocumentType
Standard
Pages
20
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 9203 : 0 USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
NASA GSFC STD 8002 : 2015 STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC A 24 : LATEST SURFACE INSULATION RESISTANCE
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
IPC WP 008 : 0 SETTING UP ION CHROMATOGRAPHY CAPABILITY

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Hardcopy - English
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